BUILDUP BOARD, AND ELECTRONIC COMPONENT AND APPARATUS HAVING THE BUILDUP BOARD

摘要

An object of the present invention is relatively simple to provide a wiring board, and electronic components and electronic equipment having it to improve the signal transmission characteristics. ; In the build-up wiring board having a core layer 140 of the wiring board or a multi-layer structure having a build-up layer 150 of multi-layer structure, the multi-layered structure is connected to a signal wiring pattern 158 and the signal wiring pattern (158) having a pad (152b), a pad insulating portion disposed around the (152b) and the pad (152b) in the same layer 156 and the conductor 154, arranged around the isolated section 156 in the same layer , with the keep is defined as the minimum distance between the nearest conductor 154 out (K) (keep out) the other characterized in that at least two portions of the multi-layer structure on the contour and the pad (152b) of the pad (152b) in the same layer which provides a package substrate 130.