A method for the selective preparation of film laminates for packaging and for insulating unhoused electronic components and conductor tracks

摘要

A method for the selective preparation of film laminates for packaging and for insulation of conductor paths (5) and unhoused electronic components (6), in which is coated with the following steps:– Selection of a surface region (2), which by means of identical demands on the properties of a film (3, 3a, 3b) on a substrate (4) arranged conductor tracks (5) and / or electronic components (6) is defined,– Selection of a the requirements of the in each case to be coated surface region (2) adapted film (3, 3a, 3b) of insulating plastic material,– Fixing of the film (3, 3a, 3b) on the surface of the substrate, by means of a vacuum,– Cutting the film (3, 3a, 3b) by means of a laser in the form of the respective surface region (2), at the same time as further fixing of the film (3, 3a, 3b) on the surface portion (2) by means of fusing of the film (3, 3a, 3b) with the surface area (2) along the cutting lines,– Removal of the by means of the form of the surface region (2),..