Wire saw for sawing silicon block into thin wafers, has two auxiliary rollers arranged in contact with wire field, where auxiliary rollers are supported about rotary axis that is arranged parallel to guide rollers and at retainers

摘要

The wire saw has two cylindrical guide rollers (2a, 2b) arranged in parallel at a distance from each other. A wire (1) rotates the two guide rollers along a portion of its periphery under formation of a wire field (13) with parallel wire sections between the guide rollers. Two auxiliary rollers (3, 4) are arranged in contact with the wire field, where the auxiliary rollers are supported about a rotary axis that is arranged parallel to the guide rollers and at retainers (6a, 6b). The auxiliary rollers contact the parallel wire sections of the wire field. An independent claim is also included for a method for sawing a silicon block.