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Wire-rod guiding roller for wire saw that is utilized for sawing e.g. silicon ingots during fabrication of wafer, has casing designed such that roller exhibits concentricity error, where concentricity error lies within specific range
Wire-rod guiding roller for wire saw that is utilized for sawing e.g. silicon ingots during fabrication of wafer, has casing designed such that roller exhibits concentricity error, where concentricity error lies within specific range
The roller (3) has an elliptical roller base body (15) rotatably mounted around a roll axis (14), where a roller casing (16) is arranged on the base body. The roller casing is designed such that the roller exhibits a concentricity error (17), where the concentricity error lies within a range of 0.5-3 mm. The roller casing exhibits a non-circular cross-sectional area and thickness that varies in a radial direction. A guide groove with varying depth is formed in a peripheral part of the casing, and the roll axis is arranged eccentric to the base body. Independent claims are also included for the following: (1) a method for producing a wire-rod guide roller (2) a wire saw (3) a method for sawing silicon ingots.
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