Material placing method for use in integrated circuit, involves positioning transfer plate opposite to target plate, where material is casted out from blind holes to contact with target plate and to place at target plate

摘要

The method involves immersing a transfer plate (10) in a material bath, in which a material is placed in a fluid condition, where the pressure acts at the bath and another pressure dominates in blind holes (100). A pressure difference is made between the pressures at the bath and in the holes, respectively, such that the holes are partially filled with the fluid material. The transfer plate is extracted from the bath. The transfer plate opposite to the target plate is positioned, where the material is casted out from the holes to contact with the target plate and to place at the target plate. An independent claim is also included for a device for executing a method for placing material.