Semiconductor component e.g. insulated gate bipolar transistor, arrangement, has semiconductor bodies of components of one type attached to common carrier, and semiconductor bodies of components of another type, attached to another carrier

摘要

The arrangement has two different types of power semiconductor components (1-6) e.g. insulated gate bipolar transistors (IGBT), with control connections (11, 21, 31, 41, 51, 61) and a load clearance between a load clearance connections (12, 13, 22, 23, 32, 33, 42, 43, 52, 53, 62, 63). Semiconductor bodies of the components of one type are attached to a common carrier, and the semiconductor bodies of the components of another type, are attached to another carrier, so that the carriers are electrically isolated from each other.