Shielding unit and heat dissipation unit combined module, has shielding unit provided on principal surface of high frequency chip, by bond and comprising welding contact, where shielding unit is arranged in vicinity of chip

摘要

The module (100) has a shielding unit (11) provided on a principal surface (12) of a high frequency chip (10), by a bond and comprising a welding contact (13) e.g. laser beam welding contact. The shielding unit is arranged in a vicinity of the chip. An insulation layer is arranged between the surface and the shielding unit, and the chip is provided on a carrier. The shielding unit is connected with the carrier by a connecting cable i.e. bonding wire. The chip is connected with the shielding unit and/or a heat dissipation unit by the bond. An independent claim is also included for a method for manufacturing a shielding and heat dissipation units combined module.