Component e.g. integrated circuit, assembly, has molding material completely surrounding carrier e.g. printed circuit board, and component and partially surrounding electrical contact strip, and holes formed beneath component

摘要

The assembly has a carrier (100) e.g. printed circuit board (PCB), and a component e.g. semiconductor component (200), in a housing. A molding material (400) completely surrounds the carrier and the component, and partially surrounds an electrical contact strip (300). The component is superimposed on the carrier that is provided with a hole (500). The electrical contact strip is directly connected with the carrier, and the holes are formed beneath the component. An independent claim is also included for a method for producing a component assembly.