Sensor module manufacturing method, arranging sensor with sensing area on support and sensing area represents support and matrial is applied to sensor and support is removed from sensing area

摘要

The method involves arranging a sensor (3a,3b,3c) with a sensing area (4a,4b,4c) on a support (6) and the sensing area represents the support. The material is applied to the sensor and support is removed from the sensing area. The sensor is integrated in a semiconductor chip (5a,5b,5c). The support is formed from the other material. Independent claims are also included for the following: (1) sensor module has a sensor with a sensing area on its main surface (2) array from sensor module consists of a support.