Device for adjusting a working point during reactive sputtering within a defined sputtering region comprises a measuring unit, an evaluating unit for calculating the intensity ratios and a control circuit for controlling reactive gas flow

摘要

Device for adjusting a working point during reactive sputtering within a defined sputtering region comprises a measuring unit (15) for acquiring the intensity values from a spectral line of the emission of a target material and the intensity values from a spectral line of the emission of an inert gas, an evaluating unit (16) for calculating the intensity ratios and a control circuit for controlling the reactive gas flow into a vacuum chamber so that the actual intensity ratio value corresponds to the theoretical value calculated using the evaluating unit. An independent claim is also included for a method for adjusting a working point during reactive sputtering within a defined sputtering region using the above device.