首页> 外国专利> Cathode sputtering process comprises preparing components of a reactive gas mixture, controlling gas flows from the reservoirs, forming a reactive gas mixture, removing part of the mixture, and feeding to a vacuum chamber

Cathode sputtering process comprises preparing components of a reactive gas mixture, controlling gas flows from the reservoirs, forming a reactive gas mixture, removing part of the mixture, and feeding to a vacuum chamber

机译:阴极溅射工艺包括制备反应性气体混合物的成分,控制来自储气罐的气流,形成反应性气体混合物,去除部分混合物以及将其送入真空室

摘要

Cathode sputtering process comprises preparing at least two components of a reactive gas mixture from different gas reservoirs, controlling gas flows from the reservoirs, combining the controlled gas flows to form a reactive gas mixture in a mixing gas vessel, removing at least 10 % of the reactive gas mixture using a pump, and feeding to a vacuum chamber.
机译:阴极溅射工艺包括:从不同的储气罐中制备反应气体混合物的至少两种成分;控制来自储气罐的气体流量;在混合气体容器中合并受控的气体流量以形成反应气体混合物;除去至少10%的混合气体。使用泵将反应性气体混合物送入真空室。

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