首页> 外国专利> Producing a card comprising a chip connected to a coil embedded in a thermoplastic material (TPM) comprises passing current through the coil so that the TPM is locally softened and the coil sinks into the TPM

Producing a card comprising a chip connected to a coil embedded in a thermoplastic material (TPM) comprises passing current through the coil so that the TPM is locally softened and the coil sinks into the TPM

机译:产生包括连接至嵌入热塑性材料(TPM)的线圈的芯片的卡的步骤包括:使电流流过线圈,以使TPM局部软化,并且线圈沉入TPM中

摘要

Producing a card with a transponder comprising a chip connected to a single-layer metal wire coil embedded in a thermoplastic material (TPM) comprises placing the coil on the TPM, passing current through the coil so that the TPM is locally softened and the coil sinks into the TPM, laminating or gluing a covering layer onto one side of the TMP and releasably attaching a support layer to the other side with an adhesive.
机译:制作带有应答器的卡,该应答器包括与嵌入到热塑性材料(TPM)中的单层金属线线圈相连的芯片,该线圈包括将线圈放在TPM上,使电流流过线圈,以使TPM局部软化并吸收线圈在TPM中,将覆盖层层压或粘合到TMP的一侧,然后用粘合剂将支撑层可释放地连接到另一侧。

著录项

  • 公开/公告号DE102006052518A1

    专利类型

  • 公开/公告日2008-05-08

    原文格式PDF

  • 申请/专利权人 SES RFID SOLUTIONS GMBH;

    申请/专利号DE20061052518

  • 发明设计人 SCATTERGOOD MARTIN;

    申请日2006-11-06

  • 分类号B29C65/44;G06K19/077;B29C65/46;B32B27/00;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:38

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