Enclosed electronic and/or opto-electronic component producing method, involves separating interconnection substrate along predetermined trace within frame, so that interconnection substrate is divided into individual components

摘要

The method involves applying an adhesive layer (12) on a lower side of a frame. A supporting substrate (1) and a cover substrate (4) are assembled on an interconnection substrate (17) such that an upper side (F1) of the substrate (1) and a lower side (F3) of the substrate (4) lie opposite to each other. Functional units are arranged in slots (7), and the adhesive layer is hardened by ultraviolet radiation. The substrate (17) is separated along a predetermined trace within the frame, so that the substrate (17) is divided into individual components. An independent claim is also included for an electronic i.e. opto-electronic component comprising a set of carrier substrates.