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High speed-LED-chip-housing structure, has reflection plate adhered to top side of base by adhesive, where reflection plate includes vertical through hole with opening, such that top sides of seat and electrodes are opened
High speed-LED-chip-housing structure, has reflection plate adhered to top side of base by adhesive, where reflection plate includes vertical through hole with opening, such that top sides of seat and electrodes are opened
The housing structure has an insulator (106) between a heat sink seat (102) and a set of electrodes (104) for providing an electric insulation between the seat and the electrodes. The seat and the electrodes are made of metallic material. A LED chip (150) is arranged on the top side of the seat. A reflection plate is adhered to the top side of a base (100) by an adhesive, where the reflection plate has a vertical through hole with an opening, such that the top sides of the seat and the electrodes are opened. An independent claim is also included for a method for manufacturing a set of housing units of high speed LED chip.
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