首页> 外国专利> High speed-LED-chip-housing structure, has reflection plate adhered to top side of base by adhesive, where reflection plate includes vertical through hole with opening, such that top sides of seat and electrodes are opened

High speed-LED-chip-housing structure, has reflection plate adhered to top side of base by adhesive, where reflection plate includes vertical through hole with opening, such that top sides of seat and electrodes are opened

机译:高速LED芯片壳体结构,其反射板通过胶粘剂粘附在底座的上侧,该反射板包括具有开口的垂直通孔,从而使座和电极的上侧开口

摘要

The housing structure has an insulator (106) between a heat sink seat (102) and a set of electrodes (104) for providing an electric insulation between the seat and the electrodes. The seat and the electrodes are made of metallic material. A LED chip (150) is arranged on the top side of the seat. A reflection plate is adhered to the top side of a base (100) by an adhesive, where the reflection plate has a vertical through hole with an opening, such that the top sides of the seat and the electrodes are opened. An independent claim is also included for a method for manufacturing a set of housing units of high speed LED chip.
机译:壳体结构在散热器座(102)和一组电极(104)之间具有绝缘体(106),用于在座和电极之间提供电绝缘。座和电极由金属材料制成。 LED芯片(150)布置在座椅的顶侧上。反射板通过粘合剂粘附到基座(100)的顶侧,其中该反射板具有带有开口的垂直通孔,从而使座和电极的顶侧敞开。还包括一种用于制造一组高速LED芯片的壳体单元的方法的独立权利要求。

著录项

  • 公开/公告号DE102007002916A1

    专利类型

  • 公开/公告日2008-07-24

    原文格式PDF

  • 申请/专利权人 HIGH POWER LIGHTING CORP.;

    申请/专利号DE20071002916

  • 发明设计人 LIN CHENG;NEI MASAMI;SU HUA-HSIN;

    申请日2007-01-19

  • 分类号H01L33/00;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:27

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