首页> 外国专利> Method for soldering components of a heat exchanger in a layer formation comprises stacking sheet metal layers and covering plates to form a stack with front sides, applying a solder to one of the front sides and further processing

Method for soldering components of a heat exchanger in a layer formation comprises stacking sheet metal layers and covering plates to form a stack with front sides, applying a solder to one of the front sides and further processing

机译:用于以层结构形式焊接热交换器的部件的方法包括堆叠金属板层和盖板以形成具有正面的堆叠,将焊料施加到正面之一并进一步处理

摘要

Method for soldering components of a heat exchanger (1) in a layer formation comprises stacking sheet metal layers (7) and covering plates (5) to form a stack (3) with front sides, applying a solder to one of the front sides (111), soldering the sealing surfaces of the sheet metal layers and the covering layers and producing a solder flow from one of the front sides over the sealing surfaces in the direction of the inside of the stack up to solder flow barriers of the heat exchanger. An independent claim is also included for a heat exchanger in a layer formation.
机译:用于以层结构形式焊接热交换器(1)的组件的方法包括堆叠金属板层(7)和盖板(5)以形成具有正面的堆栈(3),将焊料施加到其中一个正面( 111),焊接金属板层和覆盖层的密封表面,并从堆叠表面内侧的密封表面上的前侧之一向着堆叠内部的方向产生焊料流,直至热交换器的焊料流动屏障。对于层状构造的热交换器也包括独立权利要求。

著录项

  • 公开/公告号DE102007008341A1

    专利类型

  • 公开/公告日2008-08-21

    原文格式PDF

  • 申请/专利权人 BEHR GMBH & CO. KG;

    申请/专利号DE20071008341

  • 发明设计人 ANGERMANN HANS-HEINRICH;

    申请日2007-02-20

  • 分类号B23K1/14;B23K35/14;B23P15/26;B21D53/02;F01N3/24;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:25

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