Chip-removing machining process and semi-finished product

摘要

The present invention relates to a chip-removing machining methods for a semi-finished product (1) having a predetermined shape and at least one surface (2), which comprises the steps of: gluing on a protective film (4; 9) with a predetermined elongation at break to the at least one working surface (2) with a predetermined bond strength, and application of a cutting tool (3) in a predetermined position above the working surface (2), the exertion of a predetermined mechanical force in a predetermined direction over a given period of time, to the tool (3) for performing a chipping process the semi-finished product (1) and the tool is lifted (3) of the at least one surface (2) according to the predetermined time period.The use of semifinished products in order to protect against damage due to the machining residues and at the same time the drilling capacity not to be adversely affected, according to the invention by the gluing on a bond strength between the protective film (9) and the treatment surface (2) of substantially 10 n / 25 mm, and a protective film (9) with an elongation at break between 80 and 120% is used.