首页> 外国专利> Multilayered printed circuit board useful in semiconductor device, comprises an internal magnetic layer, an internal conductive layer, a dielectric layer, a signal layer formed on the dielectric layer, and a cable bushing

Multilayered printed circuit board useful in semiconductor device, comprises an internal magnetic layer, an internal conductive layer, a dielectric layer, a signal layer formed on the dielectric layer, and a cable bushing

机译:可用于半导体器件的多层印刷电路板,包括内部磁性层,内部导电层,介电层,形成在介电层上的信号层和电缆套管

摘要

The multilayered printed circuit board useful in semiconductor device, comprises an internal magnetic layer out of magnetic material, an internal conductive layer, dielectric layers (310, 341, 342), signal layers (351, 352) formed on the dielectric layers so that the dielectric layer is positioned between the signal layer and the conductive layer, and a cable bushing having internal and external surface. The signal layer is made of conductive material. The conductive layer has a measuring layer (321) or a power supply layer (322). The multilayered printed circuit board useful in semiconductor device, comprises an internal magnetic layer out of magnetic material, an internal conductive layer, dielectric layers (310, 341, 342), signal layers (351, 352) formed on the dielectric layers so that the dielectric layer is positioned between the signal layer and the conductive layer, and a cable bushing having internal and external surface. The signal layer is made of conductive material. The conductive layer has a measuring layer (321) or a power supply layer (322). The conductive layer has a first surface on which the magnetic layer is formed and a second surface on which the dielectric layer is formed. The magnetic layer is formed on the internal or external surface of the bushing and has a thickness (t) and a minimum length (L) on its surface. The magnetic layer is thinly formed so that the conditions are fulfilled and consists of magnetic units and ferrite film (331), which is formed directly on the conductive layer by a power less plating process. The conditions are t= 50mu m and L/t 1000. Each magnetism allocates and is formed through magnetic coupling of the magnetic units together under use of a strong interaction. The magnetic layer has an imaginary part-permeability (mu ) on the surface along a determined direction and the product (mu x t) of the permeability and the thickness (t) is larger than 10 mu m. The magnetic layer is formed under effect of chemical bond or van der Waals force and is formed parallel to a determined plain that is defined by a first and a second direction that are vertical to each other. The magnetic layer has a first and second permeability along the first and second direction. The permeabilities fulfill the expression of 0.5= x= 2.0, where x is a ratio of the first and the second permeability. The magnetic layer has a resistance of 0.1 omega cm or more in direct current and a permeability distribution property caused by ferromagnetic resonance. The ferrite film consists of a metal oxide composition, which is represented by a formulae of Fe aNi bZn cCo d, where a+b+c+d=3.0, 2.1= a= 2.7, 0.1= b= 0.3, 0.1= c= 0.7 and 0= d= 1.15.
机译:可用于半导体器件的多层印刷电路板包括由磁性材料制成的内部磁性层,内部导电层,形成在介电层上的介电层(310、341、342),信号层(351、352),以便电介质层位于信号层和导电层之间,并且电缆套管具有内表面和外表面。信号层由导电材料制成。导电层具有测量层(321)或电源层(322)。可用于半导体器件的多层印刷电路板包括由磁性材料制成的内部磁性层,内部导电层,形成在介电层上的介电层(310、341、342),信号层(351、352),以便电介质层位于信号层和导电层之间,并且电缆套管具有内表面和外表面。信号层由导电材料制成。导电层具有测量层(321)或电源层(322)。导电层具有在其上形成磁性层的第一表面和在其上形成介电层的第二表面。磁性层形成在衬套的内表面或外表面上,并且在其表面上具有厚度(t)和最小长度(L)。磁性层被薄薄地形成以便满足条件,并且由磁性单元和铁氧体膜(331)组成,该铁氧体膜通过无功电镀工艺直接形成在导电层上。条件是t =50μm和L / t1000。每种磁性在强相互作用的作用下通过磁性单元的磁性耦合一起分配和形成。磁性层沿确定的方向在表面上具有假想的部分磁导率(mu),磁导率与厚度(t)的乘积(mu x t)大于10μm。磁性层在化学键或范德华力的作用下形成,并且平行于由彼此垂直的第一方向和第二方向限定的确定的平面形成。磁性层沿第一和第二方向具有第一和第二磁导率。渗透率满足表达式0.5 = x = 2.0,其中x是第一渗透率与第二渗透率之比。磁性层的直流电阻为0.1Ω·cm以上,并且由铁磁共振引起的磁导率分布特性。铁氧体膜由金属氧化物组成,其由Fe aNi bZn cCo d的式表示,其中a + b + c + d = 3.0,2.1 = a = 2.7,0.1 = b = 0.3,0.1 = c = 0.7和0 = d = 1.15。

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