method and device for determining the verziehens a halbleiterscheibe

摘要

A method and device is disclosed for determining deviations of a nominally planar surface of a thin object, which is subject to warpage related to gravity, such as a wafer, relative to a reference plane. The method includes supporting the object by three support members and detecting deviations, wherein the three support members are in a position relative to each other so that each support member is located underneath the point of gravity of a circular sector of the object extending over an angular range of 120°.