To improve the mechanical strength of the bonding realized with a adhesive a base of a resin hardened by polymerization in

摘要

The present invention relates to a process making it possible to improve the mechanical strength of the bonding between the substrates, when these adhesives are made by means of an adhesive, which comprises a resin hardened by polymerization in the chain, and in particular a curable resin under the effect of a light radiation or ionisant.ce process is characterized in that it comprises the grafting on the surface of the substrates, before those - these are brought into contact with the adhesive, groups able to act as transfer agents of the chain during the polymerization of said résine.applications: assemblies of structural parts, of the engine, of the passenger compartment or body in the aeronautical, space, railway and naval and automotive.