Distributed combiner/splitter for use in integrated circuit manufacturing, has line formed of planar windings, which are interdigited with another planar windings in two levels, where windings have increasing width

摘要

The combiner/splitter has a line formed of two planar windings in two conductive levels. Another line is formed of third and fourth planar windings, which are interdigited with the planar windings in two levels, where the windings have an increasing width. Capacitive elements (C1, C2) connect external ends of the windings, where the maximum width of the windings is selected according to the current acceptable by the combiner. The former and third windings have a length difference of one quarter of a turn, and latter and fourth windings have a length difference of one quarter of a turn. An independent claim is also included for a method for manufacturing a combiner/splitter with two coupled lines.