首页> 外国专利> LED module for illumination in motor vehicle, has connecting wires connected between printed circuit boards and positive and negative connections of LED chip, and translucent resin formed on slot of heat sink and covering LED chip

LED module for illumination in motor vehicle, has connecting wires connected between printed circuit boards and positive and negative connections of LED chip, and translucent resin formed on slot of heat sink and covering LED chip

机译:用于汽车照明的LED模块,具有连接在印刷电路板之间的连接线和LED芯片的正负极连接,并且在散热器的狭缝上形成并覆盖LED芯片的半透明树脂。

摘要

The module has a heat sink (1) that comprises an upper recess in an upper side. A set of printed circuit boards (131) is provided, where the boards are fixed at a lower side of the heat sink. A set of connecting wires (21) is connected between the printed circuit boards and positive and negative connections of an LED chip (2). A translucent resin is formed on a slot (12) of the heat sink, where the resin covers the LED chip.
机译:该模块具有散热器(1),该散热器在上侧包括上凹部。提供了一组印刷电路板(131),其中这些板被固定在散热器的下侧。一组连接线(21)连接在印刷电路板与LED芯片(2)的正负连接之间。在散热器的槽(12)上形成半透明树脂,该树脂覆盖LED芯片。

著录项

  • 公开/公告号FR2905223A3

    专利类型

  • 公开/公告日2008-02-29

    原文格式PDF

  • 申请/专利权人 TAI YUN;TAI RUEY FENG;

    申请/专利号FR20070054718

  • 发明设计人 TAI YUN;TAI RUEY FENG;

    申请日2007-04-26

  • 分类号H05B33/10;F21V19;F21V29;H01L33/48;H01L33/62;H01L33/64;

  • 国家 FR

  • 入库时间 2022-08-21 19:47:10

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