Real-time three-dimensional ultrasonic imaging system for acoustic sensor, has circuit structures forming pattern extended from another pattern upto transducers elements, where former pattern includes pads formed between structures

摘要

The system has flexible circuit structures (10, 20, 30), each with a connective region (1b) having a distal part (1c) farthermost from a central main surface (1a). A wiring pattern consists of a bonding area, conductive via holes and electrical tapes and extends from the main surface upto the part. The structures form another wiring pattern that consists of upper and lower connecting pads and conductive via holes and extends from the former pattern until transducers elements, where the latter pattern includes the upper and lower connecting pads formed between the structures.