COPPER-CLAD LAMINATED SHEET, METHOD FOR MANUFACTURING WIRING SUBSTRATE USING THIS, METHOD FOR PROCESSING END FACE OF COPPER-CLAD LAMINATED SHEET AND END FACE PROCESSING APPARATUS USED FOR THIS

摘要

PROBLEM TO BE SOLVED: To provide a copper-clad laminated sheet capable of suppressing releasing of cutting waste stuck on the end face formed by cutting from the end face, a method for manufacturing a wiring substrate using this, a method for processing the end face of the copper-clad laminated sheet, and an end face processing apparatus used for this.;SOLUTION: The copper-clad laminated sheet 10 in which the end face E formed by cutting is covered with a protective material 3 consisting of a resin film, and the method for manufacturing the wiring substrate using this, are provided. In the method for processing the end face of the copper-clad laminated sheet, the resin film is heat-pressed on the end face E from one end side toward the other end side of the end face E. The end face processing apparatus for the copper-clad laminated sheet is equipped with a heat-pressing means for heat-pressing the resin film while relatively moving from the one end side toward the other end side of the end face E.;COPYRIGHT: (C)2010,JPO&INPIT