METHOD OF PLANARIZING SEMICONDUCTOR WAFER, LOCAL PLASMA TREATMENT APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method of planarizing a semiconductor wafer, a local plasma treatment apparatus, and a method of manufacturing a semiconductor wafer which can shorten the treatment time.;SOLUTION: In the method of planarizing a semiconductor wafer, an etching gas is excited by plasmas to produce a gas containing neutral active species and then the produced gas is locally supplied to the principal plane of the semiconductor wafer to locally etch the semiconductor wafer to planarize the semiconductor wafer. In the method, the in-plane surface of the semiconductor wafer is divided into a plurality of regions having a different profile of an etch rate, and a position to perform local etching is determined in each region so as to suppress a difference in profile of the etch rate among the plurality of regions.;COPYRIGHT: (C)2010,JPO&INPIT