首页> 外国专利> Cu-Zn-Sn BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING THE SAME, AND CONNECTOR

Cu-Zn-Sn BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING THE SAME, AND CONNECTOR

机译:基于Cu-Zn-Sn的铜合金板材料,其制造方法以及连接器

摘要

PROBLEM TO BE SOLVED: To provide a Cu-Zn-Sn based copper alloy sheet material having reduced Young's modulus, in which bending workability, stress relaxation resistance and stress corrosion cracking resistance, or further, high strength properties are simultaneously improved to high levels.;SOLUTION: Disclosed is a copper alloy sheet material having a composition comprising, by mass, 10 to 37% Zn and 0.1 to 4% Sn, and, when necessary, further comprising one or more kinds selected from ≤2% Ni, ≤2% Fe and ≤1% Si, or further comprising one or more kinds selected from Co, Cr, Mg, Al, B, P, Zr, Ti, Mn and V in the range of ≤3% in total, and the balance Cu with inevitable impurities, and crystal orientation satisfying I{420}/I0{420}0.8; wherein, I{420} denotes the X-ray diffraction intensity of the {420} crystal face in the sheet face of the copper alloy sheet material; and I0{420} denotes the X-ray diffraction intensity of the {420} crystal face in pure copper standard powder.;COPYRIGHT: (C)2009,JPO&INPIT
机译:要解决的问题:提供一种具有降低的杨氏模量的Cu-Zn-Sn基铜合金板材,其中弯曲加工性,抗应力松弛性和抗应力腐蚀开裂性,或者同时,高强度性能同时提高到高水平。 ;解决方案:公开了一种铜合金片材,该铜合金片材具有按质量计包含10至37%的Zn和0.1至4%的Sn的组成,并且在必要时还包含选自≤ 2%Ni,&le中的一种或多种。 ;≤2%的铁和≤1%的硅,或进一步包含选自钴,铬,镁,铝,硼,磷,锆,钛,锰和钒的一种或多种,​​总计≤3%,余量的Cu具有不可避免的杂质,晶体取向满足I {420} / I 0 {420}> 0.8;其中,I {420}表示铜合金片材的片面中的{420}晶面的X射线衍射强度。 I 0 {420}表示纯铜标准粉末中{420}晶面的X射线衍射强度。;版权:(C)2009,日本特许厅&INPIT

著录项

  • 公开/公告号JP2009062610A

    专利类型

  • 公开/公告日2009-03-26

    原文格式PDF

  • 申请/专利权人 DOWA METALTECH KK;

    申请/专利号JP20070326589

  • 申请日2007-12-18

  • 分类号C22C9/04;C22F1/08;H01B1/02;H01B13/00;H01L23/50;C22F1/00;

  • 国家 JP

  • 入库时间 2022-08-21 19:44:27

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