首页> 外国专利> METHOD OF MANUFACTURING PHOTOELECTRIC COMPOSITE SUBSTRATE, PHOTOELECTRIC COMPOSITE SUBSTRATE MANUFACTURED BY THE METHOD, AND PHOTOELECTRIC COMPOSITE MODULE USING THE SAME

METHOD OF MANUFACTURING PHOTOELECTRIC COMPOSITE SUBSTRATE, PHOTOELECTRIC COMPOSITE SUBSTRATE MANUFACTURED BY THE METHOD, AND PHOTOELECTRIC COMPOSITE MODULE USING THE SAME

机译:制造光电复合基体的方法,由该方法制造的光电复合基体以及使用该光电复合基体的光电复合模块

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a photoelectric composite substrate excellent in productivity, to provide the photoelectric composite substrate manufactured by the method, and to provide a photoelectric composite substrate module using the photoelectric composite substrate.;SOLUTION: The method of manufacturing the photoelectric composite substrate includes: a first process of sticking an optical waveguide on the substrate surface of a substrate with metal foil via an adhesive layer; and a second process of making the metal foil of the substrate with the metal foil into a conductor pattern to construct an electric wiring board.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种生产生产率优异的光电复合基板的方法,提供通过该方法制造的光电复合基板,并提供使用该光电复合基板的光电复合基板模块。制造光电复合基板的步骤包括:第一工序,通过粘接剂层将光波导用金属箔粘贴在基板的基板表面上。第二步是将具有金属箔的基板的金属箔制成导体图案,从而构成电气布线板。;版权所有:(C)2010,日本特许会计师事务所

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