RESIN FOR OPTICAL-SEMICONDUCTOR-ELEMENT ENCAPSULATION CONTAINING POLYIMIDE AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED WITH THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a resin for optical-semiconductor-element encapsulation containing polyimide having excellent heat resistance and excellent light-transmitting properties, and an optical semiconductor device containing an optical semiconductor element encapsulated with the resin.;SOLUTION: The resin for optical-semiconductor-element encapsulation is produced by imidizing a polyimide precursor obtained by subjecting 5-norbornene-2,3-dicarboxylic anhydride or maleic anhydride, an aliphatic tetracarboxylic dianhydride, and an aliphatic diamine compound to a condensation polymerization reaction.;COPYRIGHT: (C)2009,JPO&INPIT