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METHOD FOR REPLENISHING Sn-ALLOY PLATING SOLUTION WITH Sn-COMPONENT AND Sn-ALLOY PLATING TREATMENT APPARATUS

机译:用含sn成分和sn合金镀覆处理装置补足sn合金镀覆溶液的方法

摘要

PROBLEM TO BE SOLVED: To provide a method by which Sn-alloy plating solution is replenished with Sn-component at a low cost; and to provide a Sn-alloy plating treatment apparatus which is used in the method and can suppress the occurrence of sludge in the plating solution.;SOLUTION: A method for replenishing a plating solution 21 of a Sn-alloy composed of Sn and an element nobler than Sn with divalent Sn ion, is characterized in that a stannous oxide powder easily soluble in an acid or an acidic plating solution is directly added to the plating solution. When the Sn-component is resupplied, the special Sn-alloy plating treatment apparatus 20 is used, and electroplating is carried out while controlling the flow rate of an inert gas being blown into the plating solution in response to the measured value by a dissolved oxygen densitometer 41 for measuring the concentration of dissolved oxygen in the Sn-alloy plating solution 21. It is preferable that the average particle diameter of the stannous oxide powder is in a range of 10-20 μm as expressed by D50 value, and the tapping density of the powder is 0.6-1.2 g/cm3.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种以低成本向Sn合金镀覆溶液中补充Sn成分的方法。并提供一种用于该方法的锡合金电镀处理设备,该设备可以抑制电镀液中产生淤渣。解决方案:一种用于补充由锡和元素组成的锡合金的电镀液21的方法比具有二价Sn离子的Sn更贵的特征在于,将容易溶于酸或酸性镀液的氧化亚锡粉末直接添加到镀液中。再补充Sn成分时,使用特殊的Sn合金镀敷处理装置20,并根据溶解氧的测定值,控制向镀液中吹入的惰性气体的流量,并进行电镀。密度计41,用于测量Sn合金镀液21中的溶解氧浓度。优选地,氧化亚锡粉末的平均粒径在10-20μm的范围内,如D 50所示。 值,粉末的振实密度为0.6-1.2 g / cm 3 。;版权所有:(C)2009,日本特许厅&INPIT

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