首页> 外国专利> ELECTROLESS TIN PLATING BATH AND METHOD OF ELECTROLESS TIN PLATING OF ELECTRONIC COMPONENT

ELECTROLESS TIN PLATING BATH AND METHOD OF ELECTROLESS TIN PLATING OF ELECTRONIC COMPONENT

机译:无锡镀锡浴和电子组件的无锡镀锡方法

摘要

PROBLEM TO BE SOLVED: To improve temporal stability of a mildly acidic or neutral electroless tin plating bath.;SOLUTION: The electroless tin plating bath has a pH of 2.5-7 and comprises (A) a soluble stannous salt, (B) at least one acid chosen from an inorganic salt and an organic salt, (C) thioureas, (D) a complexing agent comprising oxycarboxylic acid for stabilizing the bath and (E) a metal ion chosen from the group consisting of chromium, manganese, iron, aluminum, vanadium, zirconium and molybdenum, provided that the amount of the metal ion (E) is 0.01-6.0 mol/L. Due to the coexistence of a specific metal ion such as iron, manganese and chromium at a prescribed concentration with oxycarboxylic acid, the electroless tin plating bath becomes mildly acidic or neutral and shows an excellent temporal stability.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:为改善弱酸性或中性化学镀锡浴的时间稳定性;解决方案:化学镀锡浴的pH值为2.5-7,并且包含(A)可溶性亚锡盐,(B)至少一种选自无机盐和有机盐的酸,(C)硫脲,(D)含用于稳定镀液的含氧羧酸的络合剂,以及(E)选自铬,锰,铁,铝的金属离子钒,锆和钼,条件是金属离子(E)的含量为0.01-6.0 mol / L。由于特定金属离子(如铁,锰和铬)在规定浓度下与含氧羧酸共存,化学镀锡槽变成了弱酸性或中性,并显示出极好的时间稳定性。;版权所有:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP2009035794A

    专利类型

  • 公开/公告日2009-02-19

    原文格式PDF

  • 申请/专利权人 ISHIHARA CHEM CO LTD;

    申请/专利号JP20070203214

  • 发明设计人 TANAKA KAORU;FUKAMI TAKUO;ASAHI HIROSHI;

    申请日2007-08-03

  • 分类号C23C18/31;H05K3/18;

  • 国家 JP

  • 入库时间 2022-08-21 19:42:31

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