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Semiconductor processing equipment, semiconductor processing system and semiconductor processing management method

机译:半导体加工设备,半导体加工系统和半导体加工管理方法

摘要

PROBLEM TO BE SOLVED: To provide an apparatus, a system and a method for processing a semiconductor in which the cause can be investigated and removed easily in a short time upon occurrence of abnormal data in inspection processing.;SOLUTION: The apparatus for processing a semiconductor comprises a section 22 for processing an objective semiconductor substrate according to its processing conditions, a section 24 for picking up the dynamic image of the semiconductor substrate at the time of processing, a processing control section 26 for making a decision whether the processing results satisfy specified conditions or not by associating the processing conditions, the processing results and the dynamic image from the imaging section for each processing, a section 32 for storing dynamic image information including the associated processing conditions, processing results and dynamic image while distinguishing between normal dynamic image information having processing results satisfying the specified conditions and abnormal dynamic image information having processing results not satisfying the specified conditions, and a section 38 for outputting the abnormal dynamic image information.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种用于处理半导体的装置,系统和方法,其中在检查处理中出现异常数据时,可以在很短的时间内容易地调查并消除原因。半导体包括:部分22,用于根据其处理条件来处理目标半导体衬底;部分24,用于在处理时拾取半导体衬底的动态图像;处理控制部分26,用于判断处理结果是否满足通过将处理条件,处理结果和来自成像部分的动态图像相关联来针对每个处理指定条件或不指定条件,部分32用于存储包括相关处理条件,处理结果和动态图像的动态图像信息,同时区分正常动态图像处理结果满足以下条件的信息指定条件和异常动态图像信息的处理结果不满足指定条件,以及用于输出异常动态图像信息的部分38。版权所有:(C)2003,JPO

著录项

  • 公开/公告号JP4295930B2

    专利类型

  • 公开/公告日2009-07-15

    原文格式PDF

  • 申请/专利权人 株式会社東芝;

    申请/专利号JP20010199308

  • 发明设计人 松 下 博;

    申请日2001-06-29

  • 分类号H01L21/02;H01L21/66;G01N21/956;

  • 国家 JP

  • 入库时间 2022-08-21 19:41:41

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