It possessed the conductor circuit in the single sided circuit substrate for the multilayer printed wiring board

摘要

PROBLEM TO BE SOLVED: To stabilize connection by filling a predetermined quantity of low viscosity conductive paste and then filling high viscosity conductive paste sequentially thereon thereby blocking mixture of bubble into the conductive paste or surface indention.;SOLUTION: Dry or liquid resist is applied onto the surface of an insulating basic material 20 provided with a metal layer 10 and developed and then the metal layer 10 is etched at a part not applied with the etching resist thus forming a conductor circuit 30. A roughened layer 40 is then formed on the surface and rear and a single- sided circuit board is placed thereon thus improving adhesion between the conductor circuit 30, protruding conductors and an adhesive layer. Subsequently, an adhesive layer is formed on the resin surface of the insulating basic material 20, the opening is filled with low viscosity and high viscosity conductive pastes, projecting high viscosity conductive paste is scratched off and the conductive paste is hardened preliminarily. Since high viscosity conductive paste is filled sequentially on the low viscosity conductive paste, mixture of bubble into the conductive paste and surface indention can be blocked.;COPYRIGHT: (C)2001,JPO