In formation manner of wiring pattern, production manner of the circuit substrate and on the production mannered null base substance of the light transmission body where

摘要

PROBLEM TO BE SOLVED: To provide a forming method of a wiring pattern in which a fine pattern is directly formed on a substrate and the like, to provide a manufacturing method of a circuit board, and to provide a manufacturing method of a translucent body in which a light-shielding pattern is formed.;SOLUTION: Using an ink jet device, a circuit pattern is drawn on a substrate with a metal fine particle ink in which metal fine particles whose average particle size is 100 nm or less are dispersed in water or organic solvent. Then, the substrate is processed with a heat or light ray to resolve/volatilize the polymer or surfactant contained in the circuit pattern to constitute a conductor pattern of a prescribed film thickness. Since a pattern is directly drawn with the ink jet device, an equipment cost and a production cost are low.;COPYRIGHT: (C)2002,JPO