首页> 外国专利> MAGNESIUM-MADE HOUSING COMPONENT FOR ELECTRONIC EQUIPMENT AND MAGNESIUM-MADE HOUSING FOR ELECTRONIC EQUIPMENT

MAGNESIUM-MADE HOUSING COMPONENT FOR ELECTRONIC EQUIPMENT AND MAGNESIUM-MADE HOUSING FOR ELECTRONIC EQUIPMENT

机译:电子设备用镁合金外壳组件和电子设备用镁合金外壳

摘要

PROBLEM TO BE SOLVED: To provide a magnesium-made housing component for electronic equipment, which is excellent in corrosion resistance and rigidity and is capable of being thinned to make lightweight.;SOLUTION: The magnesium-made housing component for electronic equipment is provided with: a molding consisting of a pure magnesium metal or a magnesium alloy; and a highly-rigid and dense plasma electrolytic oxidation film which is formed on the surface of the molding by subjecting the molding to plasma electrolytic oxidation and has ≥2 μm thickness and ≥200 GPa elastic modulus when measured by a nanoindentation method.;COPYRIGHT: (C)2009,JPO&INPIT
机译:要解决的问题:提供一种用于电子设备的镁制外壳部件,该外壳部件具有优异的耐腐蚀性和刚性,并且可以减薄以使其轻量化。 :由纯镁金属或镁合金组成的模制品;以及通过对模制件进行等离子体电解氧化而在模制件表面上形成的高刚性且致密的等离子体电解氧化膜,当通过纳米压痕法测量时,其具有≥2μm的厚度和≥200GPa的弹性模量。 。;版权:(C)2009,日本特许厅和INPIT

著录项

  • 公开/公告号JP2009046707A

    专利类型

  • 公开/公告日2009-03-05

    原文格式PDF

  • 申请/专利权人 KYOCERA CHEMICAL CORP;

    申请/专利号JP20070211630

  • 发明设计人 IWAMI YUZO;HIRAI TOSHINOBU;

    申请日2007-08-15

  • 分类号C25D11/30;C23C18/52;

  • 国家 JP

  • 入库时间 2022-08-21 19:40:11

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