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These production methods, and a thermoelectric module using thermoelectric semiconductor elements thermoelectric semiconductor material, with the thermoelectric semiconductor material, the thermoelectric semiconductor element

机译:这些制造方法以及使用了热电半导体材料的热电模块,热电半导体材料,以及热电半导体材料,

摘要

PROBLEM TO BE SOLVED: To improve crystal orientation and make a thermoelectric performance index high.;SOLUTION: In a component adjustment step I, a metal mixture wherein an excessive Te is added to a (Bi-Sb)2Te3-based composition is adjusted. In an annealed foil manufacturing step II, after the metal mixture is melted, it is coagulated at a thickness of 30 m or more on the surface of a cooling roll at a peripheral speed of 5 m/sec or less, and a plate-like thermoelectric semiconductor material 10 is manufactured wherein a Te rich phase is dispersed in a refined manner in a composite compound semiconductor phase and the extending directions of C planes of almost crystal grains are oriented. In a solidification molding step III, the thermoelectric semiconductor materials 10 are stacked in a direction of thickness, and after a molding 12 is formed by solidification and molding, the molding 12 is subject to plastic deformation in a plastic deformation step IV in a manner that a shear force may be given in a uniaxial direction nearly parallel to the main lamination direction of the thermoelectric semiconductor material 10, thereby manufacturing a thermoelectric semiconductor material 17 having a crystal orientation wherein the extending direction of the C plane with hexagonal structure of the crystal grains is almost matched with a C-axis direction.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提高晶体取向并提高热电性能指标。解决方案:在组分调整步骤I中,向(Bi-Sb) 2 Te 3 的成分。在退火箔的制造工序II中,使金属混合物熔融后,以5m / sec以下的圆周速度在冷却辊的表面以30m以上的厚度凝结成板状。制造热电半导体材料10,其中富Te相以精细的方式分散在复合化合物半导体相中,并且使几乎晶粒的C面的延伸方向取向。在固化成型步骤III中,将热电半导体材料10沿厚度方向堆叠,并且在通过固化和成型形成成型品12之后,以如下方式使成型品12在塑性变形步骤IV中经历塑性变形:可以在几乎平行于热电半导体材料10的主层叠方向的单轴方向上施加剪切力,从而制造具有晶体取向的热电半导体材料17,其中C平面的延伸方向具有晶粒的六边形结构。几乎与C轴方向匹配。;版权所有:(C)2005,JPO&NCIPI

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