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Process parameter or design rule and manner and the production manner of the semiconductor integrated circuit device which decide the both of process parameter, process parameter or process parameter in order to form the circuit layout of design rule and the system, and
Process parameter or design rule and manner and the production manner of the semiconductor integrated circuit device which decide the both of process parameter, process parameter or process parameter in order to form the circuit layout of design rule and the system, and
PROBLEM TO BE SOLVED: To provide a method and a system which simultaneously decide optimal design rules and the optimal process parameters while reducing the chip area.;SOLUTION: A design rule (D.R,)/process parameter (P.P) decision system 2 is provided with a compaction means 8 which compacts design layout data based on a D.R. table, a chip size information acquisition means 10 which calculates chip size information of the compacted layout data, a shape information acquisition means 14 which predicts the finished shape of the compacted layout on a wafer according to the P.P, a comparison means 16 which compares the predicted finished shape with the compacted layout, a dangerous pattern information acquisition means 18 which extracts a dangerous pattern from the compacted layout based on a comparison result and a decision means 20 which decides at least one of the D.R. and the P.P. so that both of the chip size and the dangerous pattern satisfy prescribed evaluation conditions.;COPYRIGHT: (C)2004,JPO
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