首页> 外国专利> Resin composition, a sheet, a prepreg-like material using the same, with the metal foil sheets, laminates, electrically insulating materials, and resist materials

Resin composition, a sheet, a prepreg-like material using the same, with the metal foil sheets, laminates, electrically insulating materials, and resist materials

机译:树脂组合物,片,使用其的预浸料状材料,金属箔片,层叠体,电绝缘材料和抗蚀剂材料

摘要

PROBLEM TO BE SOLVED: To provide a resin composition with high heat resistance and high dielectric constant and low dielectric loss tangent in high-frequency region, and to provide sheets, prepreg-like materials, metallic foil-clad sheets, laminated boards, electrical insulation materials and resist materials each using the resin composition.;SOLUTION: The resin composition comprises a polyester, an epoxy resin, a curing promoter and dielectric powder, wherein the polyester is composed of an aromatic polycaroxylic acid residue having an aryloxycarbonyl group or arylcarbonyloxy group on the molecular chain end and an aromatic polyhydroxy compound residue. This resin composition has a dielectric constant of at least 4 and a Q-value of at least 250.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供在高频区域中具有高耐热性,高介电常数和低介电损耗角正切的树脂组合物,并提供片材,预浸料,金属箔包覆片材,层压板,电绝缘性解决方案:树脂组合物包含聚酯,环氧树脂,固化促进剂和介电粉末,其中聚酯由在其上具有芳基氧羰基或芳基羰基氧基的芳族聚环氧烷酸残基组成。分子链末端和芳族多羟基化合物残基。该树脂组合物的介电常数至少为4,Q值至少为250。版权所有:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP4227941B2

    专利类型

  • 公开/公告日2009-02-18

    原文格式PDF

  • 申请/专利权人 TDK株式会社;

    申请/专利号JP20040239888

  • 发明设计人 高谷 稔;川畑 賢一;森田 高章;

    申请日2004-08-19

  • 分类号C08G59/40;B32B15/09;C08J5/24;C08K3/22;C08K5/03;C08L9;C08L25;C08L63;C08L67/03;H05K1/03;

  • 国家 JP

  • 入库时间 2022-08-21 19:37:41

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