首页> 外国专利> Caulking closure method of the resin product using the welding tip and the welding tip for caulking barrette resin product

Caulking closure method of the resin product using the welding tip and the welding tip for caulking barrette resin product

机译:使用焊接头和用于压印发夹树脂产品的焊接头对树脂产品进行填缝封闭的方法

摘要

PROBLEM TO BE SOLVED: To provide a welding chip and a caulking method where caulking strength is not deteriorated by forming a void with infiltrating a gas body into a welded thick wall part.;SOLUTION: A cooling pin 16 is formed at the center of the welded surface 2 of the welding chip 1, and a cooling recessed part 17 is formed on the back surface 2a of the welded surface 2. The gas body g with which a bottom space 11b of a hollow hole 11a of the welded boss 11 is filled is allowed to blow off to the welded surface 2 side through the clearance 19 made in the skin layer 18 by forming the skin layer 18 on the resin surface quickly contacting to the cooling pin 16 at the melting time to prevent the void 15 from being formed with infiltrating the gas body g into the welded thick wall part 14. Productivity is improved along with improvement in welding strength by caulking using the welding chip 1 forming a narrowed step 21 on the inner peripheral surface 3a of the peripheral side wall 3.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种焊接芯片和压紧方法,该方法不会通过使气体渗透到焊接的厚壁部分中而形成空隙而不会降低压紧强度。解决方案:冷却销钉16形成在焊缝的中心。在焊接片1的焊接面2上形成有冷却凹部17。在焊接面2的背面2a上形成有冷却凹部17。气体g填充有焊接凸台11的中空孔11a的底部空间11b。通过在熔化时迅速接触冷却销16的树脂表面上形成表皮层18,从而允许通过形成在表皮层18上的间隙19吹到焊接表面2侧,以防止形成空隙15。通过使气体体g渗入到焊接的厚壁部14中,通过在周壁3的内周面3a的内周面3a上形成狭窄的台阶21的焊接芯片1进行铆接加工,从而提高了生产率并提高了焊接强度。版权:(C)2008,日本特许厅和INPIT

著录项

  • 公开/公告号JP4251504B2

    专利类型

  • 公开/公告日2009-04-08

    原文格式PDF

  • 申请/专利权人 ムネカタ株式会社;

    申请/专利号JP20060320959

  • 发明设计人 森田 勉;

    申请日2006-11-29

  • 分类号B29C65/20;B29C65/56;

  • 国家 JP

  • 入库时间 2022-08-21 19:37:33

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号