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Semiconductor device failure analysis, failure analysis method, and failure analysis program

机译:半导体器件故障分析,故障分析方法和故障分析程序

摘要

Disclosed is a semiconductor device reliably and efficiently semiconductor failure analysis apparatus capable of performing the analysis of the failure of, and provides a method, and an analysis program analysis. The apparatus includes a test information acquisition unit 11 for acquiring a failure observed image P2 of a semiconductor device, a layout information acquiring section 12 for acquiring layout information, a failure analyzer 13 for analyzing the failure of the semiconductor device, the analysis results configuring the failure analyzer 10 by the analysis screen display controller 14 for displaying information on the display device 40. Failure analyzer 13, as well as set the analysis region by referring to the failure observed image P2, to extract a net passing the analysis region for a plurality of nets included in the layout of the semiconductor device. [Selection Figure] Figure 1
机译:公开了一种能够可靠且有效地进行故障分析的半导体装置,并且提供了一种方法以及分析程序分析。该设备包括:测试信息获取单元11,用于获取半导体器件的故障观察图像P2;布局信息获取部分12,用于获取布局信息;故障分析器13,用于分析半导体器件的故障;分析结果构成了故障分析器10由分析屏幕显示控制器14在显示装置40上显示信息。故障分析器13,以及通过参考故障观察图像P2设置分析区域,以提取通过多个分析区域的网。半导体器件的布局中包含的网的数量。 [选型图]图1

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