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The constituent for the soft resin compact which is superior in hot shearing adhesion performance and the soft resin compact null A which

机译:具有优异的热剪切粘合性能的软树脂成型体的成分,以及软树脂成型体的成分A。

摘要

PPROBLEM TO BE SOLVED: To provide a composition which can give a flexible resinous molded body having together the flexibility and heat resistance and also having the excellent pressure-sensitive adhesion and under-shear adhesive performance at high temperatures. PSOLUTION: The composition for a flexible resinous molded body contains A: a solventless type of an acrylic-based copolymer containing a hydroxy group as a functional group of on the average from not less than 2.2 to not more than 2.7 per one molecule and having a number-average molecular weight of 8,000-30,000 and the fluidity at normal temperatures, B: a solventless type of an acrylic-based copolymer containing a hydroxy group as a functional group of on the average from not less than 1.3 to not more than 2.1 per one molecule and having a number-average molecular weight of 2,000-7,000 and the fluidity at normal temperatures, and C: a liquid isocyanate compound containing an isocyanate group as a functional group and having the fluidity at normal temperatures; and the flexible resinous molded body is obtained by curing the composition. PCOPYRIGHT: (C)2005,JPO&NCIPI
机译:<解决的问题:提供一种组合物,该组合物可以提供具有挠性和耐热性并且在高温下还具有优异的压敏粘合性和剪切剪切粘合性的挠性树脂成型体。

解决方案:挠性树脂成型体用组合物包含A:无溶剂型丙烯酸基共聚物,其每一个分子平均具有不小于2.2至不大于2.7的羟基作为官能团。 B:数均分子量为8,000-30,000且在常温下具有流动性,B:无溶剂型丙烯酸基共聚物,其平均羟基数为1.3以上且不大于1.3。 C:以异氰酸酯基为官能团且在常温下具有流动性的液体异氰酸酯化合物,每1分子为2.1以下,数均分子量为2,000〜7,000,且在常温下具有流动性。通过使组合物固化而获得挠性树脂成型体。

版权:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP4232094B2

    专利类型

  • 公开/公告日2009-03-04

    原文格式PDF

  • 申请/专利权人 アキレス株式会社;

    申请/专利号JP20030284003

  • 发明设计人 原澤 純一;鈴木 卓郎;

    申请日2003-07-31

  • 分类号C08G18/62;C08G18/72;

  • 国家 JP

  • 入库时间 2022-08-21 19:37:15

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