首页> 外国专利> Electronic component supplying device, an electronic component mounting apparatus and electronic component mounting method using the same

Electronic component supplying device, an electronic component mounting apparatus and electronic component mounting method using the same

机译:电子零件供给装置,电子零件安装装置及使用该电子零件供给装置的电子零件安装方法

摘要

PROBLEM TO BE SOLVED: To dispense with the time for changing the suction height of a suction nozzle by positioning and fixing a parts suction face to a prescribed reference face in an electronic parts supplying apparatus.;SOLUTION: The electronic parts supplying apparatus 40 is provided with a tape guide 44 and a tape table 71 which respectively nipping a tape T from its upper side and lower side to a part-suction position Pn. The tape guide 44 where a take-out opening 44a1 for taking out a part P housed in the tape T is formed is fixed to a main body frame 41. The tape table 71 supporting the tape T in a transportable manner is fitted to the main body frame 41 in a vertically movable manner, and provided with a spring 72 for biasing the tape 71 toward the tape guide 44.;COPYRIGHT: (C)2004,JPO&NCIPI
机译:解决的问题:为了省去通过在电子零件供应装置中将零件吸引面定位并固定到规定的基准面上来改变吸嘴的吸引高度的时间。解决方案:提供了电子零件供应装置40分别具有从其上侧和下侧将带子T夹到部分抽吸位置Pn的带子导向器44和带子台71。形成有用于取出容纳在带子T中的部分P的取出开口44a1的带子导向器44固定到主体框架41。以可移动的方式支撑带子T的带子台71安装到主体上。主体框架41以可垂直移动的方式设置,并且设有弹簧72,该弹簧72用于将带71朝着带引导件44偏压。版权所有:(C)2004,JPO&NCIPI

著录项

  • 公开/公告号JP4234451B2

    专利类型

  • 公开/公告日2009-03-04

    原文格式PDF

  • 申请/专利权人 富士機械製造株式会社;

    申请/专利号JP20030012836

  • 发明设计人 近藤 義之;細野 誠;

    申请日2003-01-21

  • 分类号H05K13/02;

  • 国家 JP

  • 入库时间 2022-08-21 19:37:06

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