首页> 外国专利> Etching method, it is low production method of the permittivity dielectric membrane, production method and the etching device and the thin film production device of the porous component

Etching method, it is low production method of the permittivity dielectric membrane, production method and the etching device and the thin film production device of the porous component

机译:蚀刻方法是介电常数介电膜的低制造方法,多孔性成分的制造方法以及蚀刻装置和薄膜制造装置

摘要

The etching method of applying CVD of new system and the etching device which can be applied to this are offered. The to plasma converting halogen, with the halogen radical which can and being halogen radical, etching precious metal component 11, it executes with the adsorption process which makes the crystalline germ adsorb which consists of precusor 24 on baseplate 3 can the precious metal component and the precusor 24 which consists of halogen making use of, and the etching process which being halogen radical, anisotropy etches the part to which the crystalline germ of baseplate 3 adsorbs in thickness direction.
机译:提供了应用新系统的CVD的蚀刻方法以及可以应用于该方法的蚀刻装置。通过等离子体处理将卤素转变成等离子体,将卤素和能够成为卤素的自由基蚀刻贵金属成分11,并通过吸附处理使基板3上的由前驱体24构成的结晶菌吸附到贵金属成分上。利用卤素构成的前驱体24和作为卤素自由基的蚀刻处理,各向异性地蚀刻基板3的结晶菌在厚度方向上吸附的部分。

著录项

  • 公开/公告号JPWO2006118271A1

    专利类型

  • 公开/公告日2008-12-18

    原文格式PDF

  • 申请/专利权人 株式会社フィズケミックス;

    申请/专利号JP20070514848

  • 发明设计人 坂本 仁志;小林 千香子;

    申请日2006-04-28

  • 分类号H01L21/3065;C23C16/06;

  • 国家 JP

  • 入库时间 2022-08-21 19:37:06

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