As it possesses the wiring substrate null component 1st principal plane, the component 2nd principal plane and was formed

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable wiring board consisting of a semiconductor element, a reinforcement and a substrate with a high yield.;SOLUTION: The wiring board 11 consists of a semiconductor element 21, a reinforcement 31 and a substrate 41. The semiconductor element 21 has an element first major surface 23, an element second major surface 24, and a flip-chip connection terminal 22 formed on the element second major surface 24 side. The semiconductor element 21 has a thermal expansion coefficient smaller than 5.0 ppm/°C and a dielectric constant smaller than 4. The resin substrate 41 has a substrate first major surface 42 and a substrate second major surface 43. The semiconductor element 21 is flip-chip connected to at least one side of the substrate first major surface 42 and the substrate second major surface 43 in the resin substrate 41. The reinforcement 31 is bonded to at least one surface of the substrate first major surface 42 and the substrate second major surface 43 of the resin substrate 41 under surface contact state. The reinforcement 31 is made of a material having rigidity higher than that of the semiconductor element 41.;COPYRIGHT: (C)2005,JPO&NCIPI