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Package Substrate Including Surface Mount Component Mounted on a Peripheral Surface thereof and Microelectronic Package Including Same
Package Substrate Including Surface Mount Component Mounted on a Peripheral Surface thereof and Microelectronic Package Including Same
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机译:包括安装在其外围表面上的表面安装组件的封装基板以及包括该封装基板的微电子封装
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摘要
A microelectronic combination and a method of making the combination. The combination includes a package substrate including a substrate body having a peripheral surface and contacts disposed at the peripheral surface; and a surface mount component electrically and mechanically bonded to the contacts.
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