首页> 外国专利> METHOD FOR PRE-TREATING EPITAXIAL LAYER, METHOD FOR EVALUATING EPITAXIAL LAYER, AND APPARATUS FOR EVALUATING EPITAXIAL LAYER

METHOD FOR PRE-TREATING EPITAXIAL LAYER, METHOD FOR EVALUATING EPITAXIAL LAYER, AND APPARATUS FOR EVALUATING EPITAXIAL LAYER

机译:预处理表位层的方法,评估表位层的方法以及评估表位层的装置

摘要

An apparatus for evaluating an epitaxial layer, including pre-treating the epitaxial layer before evaluation of the epitaxial layer by making the epitaxial layer contact with a metal electrode by a capacitance-voltage measurement, the method comprising; applying carbon-bearing compound to a surface of the epitaxial layer; subsequently irradiating ultraviolet light to the surface of the epitaxial layer; and thereby forming an oxide film on the surface of the epitaxial layer.;An apparatus for evaluating an epitaxial layer of an epitaxial wafer, the apparatus including a pretreatment unit for pre-treating an epitaxial wafer having a semiconductor wafer and an epitaxial layer formed on the semiconductor wafer, a metal-electrode which can be made contact with or vapor-deposited on the surface of the epitaxial layer of the epitaxial wafer which has been pre-treated in the pretreatment unit, a measuring electrode which can be made contact with or vapor-deposited on the semiconductor wafer, and a measuring unit which is connected to each of the electrodes and is used to measure physical properties of the epitaxial layer. The pretreatment unit includes an applying device for applying a carbon-bearing compound to a surface of the epitaxial layer, and an irradiation device for irradiating ultraviolet light to the surface of the epitaxial layer in an oxygen-bearing atmosphere.
机译:一种用于评估外延层的设备,该方法包括:通过电容电容测量使外延层与金属电极接触,从而在评估外延层之前对外延层进行预处理。将含碳化合物涂覆到外延层的表面上;随后向外延层的表面照射紫外线;用于评估外延晶片的外延层的设备,该设备包括预处理单元,该预处理单元用于对具有半导体晶片和在其上形成的外延层的外延晶片进行预处理。半导体晶片,可以与在预处理单元中进行了预处理的外延晶片的外延层的表面接触或气相沉积的金属电极,可以与或接触的测量电极。气相沉积在半导体晶片上,以及测量单元,该测量单元连接到每个电极并且用于测量外延层的物理性质。预处理单元包括:用于将含碳化合物施加到外延层的表面上的施加装置;以及用于在含氧气氛中将紫外线照射到外延层的表面上的照射装置。

著录项

  • 公开/公告号US2009072853A1

    专利类型

  • 公开/公告日2009-03-19

    原文格式PDF

  • 申请/专利权人 SHINJIROU UCHIDA;SUMIO MIYAZAKI;

    申请/专利号US20080274211

  • 发明设计人 SHINJIROU UCHIDA;SUMIO MIYAZAKI;

    申请日2008-11-19

  • 分类号G01R31/26;

  • 国家 US

  • 入库时间 2022-08-21 19:35:22

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