Minimizing The Number Of External Terminals Required When Compensation Is To Be Provided For Signal Drop In Bond Wire Of A Package In Which An Integrated Circuit Is Provided

摘要

Compensation is provided for signal drop in bond wires of an integrated circuit (IC) while minimizing the number of external terminals in the IC package. A functional circuit provides an output signal (e.g., voltage) on a pad of the IC, which is connected to an external terminal on the package via a bond wire. A second circuit contained in the IC determines the signal drop in the bond wire by examining a parameter (e.g., current) proportional to a strength of the output signal at or before the pad in a transmission path of the signal. Thus, additional external terminals to sense the signal strength at a point external to the IC to provide compensation for the drop may not be required.