首页> 外国专利> Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same

Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same

机译:具有减小的热膨胀的无卤素电路化基板,其制造方法,利用该基板的多层基板结构以及使用该基板的信息处理系统

摘要

A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein. A method of making such a substrate is also provided, as is a multilayered assembly including one or more such circuitized substrates, possibly in combination with other substrates. An information handling system designed for having one or more such circuitized substrates is also provided.
机译:一种电路基板,其包括复合层,该复合层包括第一介电子层和第二介电子层,该第一介电子层包括无卤树脂和分散在其中的纤维,该第二介电子层不包含纤维,但第二介电子层还包含无机颗粒的无卤树脂。还提供了一种制造这种基板的方法,包括一种多层组件,该多层组件包括一个或多个这种电路化的基板,可能与其他基板组合。还提供了一种信息处理系统,设计用于具有一个或多个这样的电路化基板。

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