首页> 外国专利> Radial Block Copolymers and Adhesives Based Thereon With Improved Die-Cutting Performance

Radial Block Copolymers and Adhesives Based Thereon With Improved Die-Cutting Performance

机译:具有改进的模切性能的径向嵌段共聚物和基于其的粘合剂

摘要

Improved adhesives are provided through the use of styrenic radial block copolymers, containing at least 40 wt % diblock copolymers, the adhesives have improved adhesive properties and a reduced elastic behavior under die-cutting conditions. Compared to conventional linear block copolymers of similar molecular weight, radial copolymers offer higher holding power and lower melt viscosity for the adhesive. They therefore contribute to an improved balance between processability and end-use properties.
机译:通过使用包含至少40重量%的二嵌段共聚物的苯乙烯径向嵌段共聚物提供了改进的粘合剂,该粘合剂在模切条件下具有改善的粘合性能和降低的弹性性能。与具有类似分子量的常规线性嵌段共聚物相比,径向共聚物为粘合剂提供了更高的保持力和更低的熔融粘度。因此,它们有助于改善可加工性和最终用途性能之间的平衡。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号