首页> 外国专利> DOUBLE-SIDED WIRING BOARD, MANUFACTURING METHOD OF DOUBLE-SIDED WIRING BOARD, AND MOUNTING DOUBLE-SIDED WIRING BOARD

DOUBLE-SIDED WIRING BOARD, MANUFACTURING METHOD OF DOUBLE-SIDED WIRING BOARD, AND MOUNTING DOUBLE-SIDED WIRING BOARD

机译:双侧接线板,双侧接线板的制造方法以及双侧接线板的安装

摘要

In one embodiment of the present invention, a connecting device of a double-sided wiring board includes a first-side connecting land portion configured by a first-side conductive layer and a first-side connecting conductive layer and a second-side connecting land portion configured by a second-side conductive layer; the first-side connecting land portion and the second-side connecting land portion face each other at respective central portions with an insulating substrate sandwiched therebetween; a substrate hole is formed corresponding to a peripheral end portion of the first-side connecting land portion and a peripheral end portion of the second-side connecting land portion; and the peripheral end portion of the first-side connecting land portion and the peripheral end portion of the second-side connecting land portion are connected to each other via the substrate hole.
机译:在本发明的一个实施方式中,双面线路板的连接装置包括:第一侧连接焊盘部,其由第一侧导电层,第一侧连接导电层和第二侧连接焊盘部构成。由第二侧导电层构成;第一侧连接焊盘部分和第二侧连接焊盘部分在各自的中央部分彼此面对,并且在它们之间夹有绝缘基板。对应于第一侧连接陆部的外周端部和第二侧连接陆部的外周端部形成基板孔。第一侧连接陆部的外周端部和第二侧连接陆部的外周端部经由基板孔相互连接。

著录项

  • 公开/公告号US2009133918A1

    专利类型

  • 公开/公告日2009-05-28

    原文格式PDF

  • 申请/专利权人 HITOSHI KASHIO;

    申请/专利号US20080193492

  • 发明设计人 HITOSHI KASHIO;

    申请日2008-08-18

  • 分类号H05K1/11;H01B13/00;

  • 国家 US

  • 入库时间 2022-08-21 19:33:30

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