ADDITION CURING SILICONE COMPOSITION FOR CIPG THAT YIELDS CURED PRODUCT WITH EXCELLENT COMPRESSION SET, AND METHOD OF REDUCING COMPRESSION SET OF CURED PRODUCT OF THE COMPOSITION

摘要

Provided is an addition curing silicone composition for CIPG, including: (A) 100 parts by mass of an organopolysiloxane containing at least two alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane, in sufficient quantity to provide from 0.4 to 10.0 mols of hydrogen atoms bonded to silicon atoms within this component (B) for every 1 mol of alkenyl groups bonded to silicon atoms within the entire composition, (C) an effective quantity of a platinum group metal-based catalyst, (D) a curing retarder, and (E) an acid-receiving agent which is inorganic. The composition yields a cured product with particularly superior compression set, and exhibits excellent storage stability, curing stability (curability following storage), and adhesion. The compression set for a cured product of an addition curing silicone composition including the aforementioned components (A) through (D) can be reduced by preparing a composition including said components (A) through (E) and curing said composition including said components (A) through (E) at room temperature or under heating.