METHOD OF IMPROVING INTERCONNECTION BETWEEN ALUMINUM AND COPPER IN SEMICONDUCTOR METAL LINE PROCESS

摘要

A method for enhancing an aluminum-copper interconnection in a semiconductor metal line process. In order to solve a reduction in wafer yield due to copper segregation resulting from a time delay during a metal deposition process, copper precipitates are re-solidified into the aluminum film through a quench process of performing annealing on the wafer at a predetermined temperature for a predetermined time correlating to the time delay.